Dimensity 6400: What’s New?
The Dimensity 6400 is built on TSMC’s 6nm process and features an octa-core CPU configuration:
• 2x Cortex-A76 cores clocked at 2.5GHz (up from 2.4GHz on the 6300).
• 6x Cortex-A55 cores running at 2.0GHz (unchanged).
• Mali-G57 MC2 GPU likely with a small clock speed boost.
This slight CPU overclock gives the 6400 a minor edge in performance while maintaining efficiency.
Dimensity 6400 Specifications
| Feature | Dimensity 6400 | Dimensity 6300 | Helio G100 |
|---|---|---|---|
| Process Node | TSMC 6nm | TSMC 6nm | TSMC 6nm |
| CPU (Big Cores) | 2x Cortex-A76 @ 2.5GHz | 2x Cortex-A76 @ 2.4GHz | 2x Cortex-A76 @ 2.2GHz |
| CPU (Small Cores) | 6x Cortex-A55 @ 2.0GHz | 6x Cortex-A55 @ 2.0GHz | 6x Cortex-A55 @ 2.0GHz |
| GPU | Mali-G57 MC2 | Mali-G57 MC2 | Mali-G57 MC2 |
| RAM | LPDDR4X (2,133MHz) | LPDDR4X (2,133MHz) | LPDDR4X |
| Storage | UFS 2.2 | UFS 2.2 | UFS 2.2 |
| Display | Up to 1080p+ @ 120Hz | Up to 1080p+ @ 120Hz | Up to 1080p @ 120Hz |
| Camera | Up to 108MP | Up to 108MP | Up to 200MP |
| Modem | 5G, 3.3Gbps (Release 16) | 5G, 3.3Gbps (Release 16) | 4G |
| Wi-Fi | Wi-Fi 5 (ac) | Wi-Fi 5 (ac) | Wi-Fi 5 (ac) |
| Bluetooth | 5.2 | 5.2 | 5.2 |
| GNSS | Dual-band | Dual-band | Dual-band |
Old Design, New Devices
Despite its minor enhancements, the Dimensity 6400 is based on a design dating back to Dimensity 810 (2021), which featured a similar CPU and GPU configuration. However, the 6400 improves in areas like:
• Better 5G speeds (up to 3.3Gbps, up from 2.77Gbps on the Dimensity 810).
• Higher camera support (108MP vs. 64MP).
• Newer Bluetooth 5.2 for better connectivity.
Upcoming Devices
The Realme P3x 5G will be among the first smartphones powered by the Dimensity 6400, with its launch scheduled for tomorrow. More budget-friendly 5G devices are expected to feature this chipset soon.
While not a revolutionary upgrade, the Dimensity 6400 provides slight performance gains and better connectivity, making it a practical choice for affordable 5G smartphones.
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